Semiconductor Failure Analysis is complex forensic sleuthing that follows a multi-step path beginning with fault verification (Level I) and proceeding into Level II and III destructive techniques to determine the location and cause of an anomaly in a chip or integrated circuit. The skills and experience of the engineers that guide this work are as critical to this process as the sophisticated imaging, materials characterization, electrical, optical, chemical, and physical testing equipment that are applied to your work.
FIB Circuit Editing is key to prototyping devices and getting them to market faster. Through a closed-loop, iterative process, a circuit can be tested, repaired, and retested right in the laboratory, eliminating weeks and months of trial and error and mask modifications. Nanolab Technologies has the equipment and expertise to support this process cost-effectively.
How May We Help You?
Using cutting edge technology and expertise, Nanolab Technologies provides Knowledge Based Analytical Services for Advanced Microscopy, Chemical Analysis, Defect Analysis, Materials Analysis, FIB Circuit Edit, and Electrical Failure Analysis in support of the following industries:
- Semiconductor
- Optics
- LED
- Solar
- Nanotechnology
- Medical Devices
- Polymers
- Glass
- Laser
- Optics
- Defense
- Film Coatings
- Advanced Packaging
- PCB
- MEMS
- Other High Tech Industries
Nanolab Technologies’ highly skilled, and experienced team of scientists, engineers, and analysts provides industry leading techniques to help you solve your problems or characterize your materials.
With two, purpose designed, new facilities, state-of-the-art laboratories equipped with leading edge microscopy and analytical tools, and ultra high spatial resolution, Nanolab Technologies offers the finest knowledge based analytical solutions available today.
Combined with outstanding customer centered sales and service, and rapid response, Nanolab Technologies provides customers with knowledge based solutions and analytical information required to meet the challenges of ever smaller geometries, new and exotic materials, and advanced processes.
