Uses X-rays to image devices, boards and medical devices non-destructively with 0.5µ spatial resolution
2D & 3D X-ray Imaging use X-rays that pass through a sample and observe the intensity of the X-rays that have made it through the sample. This provides an image which is a gray scale density map of the sample (the more dense materials absorb more X-rays and are darker). This method of physical failure analysis allows inspection of wires, traces, solder and other objects inside the device in a non-destructive fashion.
3D X-Ray image of a Through-Silicon-Via (TSV)
C-mode SAM is another non-destructive imaging tool. Please review that page to learn more about C-SAM.